When you want an underfill designed for use on very fine area array devices where SMT transparent processing is critical, LOCTITE® ECCOBOND E 1172 A is an excellent choice. This void-free, epoxy-based underfill encapsulant can be used on flip-chip devices with as small as 25-micron geometries. When applied, LOCTITE® ECCOBOND E 1172 A provides a uniform encapsulation with a strong adhesive force, maximizing the device's temperature cycling capability by distributing stress away from solder connects.
FEATURES:

• One component
• Medium flow
• High performance