LOCTITE® LF 318 solder paste is a halide-free, no clean, pin testable Pb-free solder paste, formulated to have excellent humidity resistance and a broad process window, both for reflow and printing. This product has a high tack force to resist component movement during high speed placement and long printer abandon times. LOCTITE LF 318 shows excellent solderability over a wide range of reflow profiles in both air and nitrogen across a wide range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP copper.
FEATURES:

• Good humidity resistance. Gives excellent coalescence even after 72 hours exposure to 27ºC/80% RH, reducing process variation due to environmental factors
• Soft, non-stick, pin testable residues allow easy in-circuit testing
• Suitable for fine pitch, high speed printing up to 150mm/s (6""/s)
• Colorless residues for easy post-reflow inspection