LOCTITE® HYDX-20 will solder copper, brass, nickel and mild steel efficiently. It will not spatter during preheating and soldering. The soldering residues from LOCTITE HYDX-20 are readily washed off to leave a surface which easily meets the requirements of MIL-P-28809A ionic contamination test. LOCTITE HYDX-20 Water Soluble Flux is formulated for use on electronic assemblies which have been designed for water cleaning and will therefore meet the demand for those fluxes whose residues need not be removed in CFC type cleaning solvents. A number of safety features have been built into the formulation of Hydro-X/20, particularly the fact that residues after soldering do not create excessive foam in the washing water and can be considered safe for disposal.
FEATURES:

• Highly water soluble solder residues eliminates CFC usage
• No penetration of properly cured solder resists
• Leaves boards very clean with no white residues after washing
• No solder balls on dry film resists