LOCTITE® MF R301 is a no clean, high activity liquid flux for surfaces with poor solderability from the pioneers of “no clean” technology. Fast soldering on conventional leaded and SMD components – no bridges or icicles. Exceptional through-hole penetration. Sustained performance for maximum process window. No cleaning – reduces costs. Minimal residues to interfere with ATE probes without cleaning. Compatible with rosin-based surface preservatives. Foam, spray or wave application.
FEATURES:

• For surfaces with poor solderability
• No clean, high activity liquid flux
• No cleaning – reduces costs
• Compatible with rosin-based surface preservatives